The relevant market for MEMS radio front-end products is projected to grow to $2 billion by 2009, which encompasses not only early sales in test equipment, critical civilian and military radios, and high-end antenna applications, but high-volume multi mode multi standard products for wireless networking equipment and consumer handsets and PDAs.

XCom's agile solutions will enable wireless device product companies to achieve greater economies of scale by implementing a modular MEMS enabled platform strategy.

Dr. Daniel Hyman, XCom's co-founder and president, is an internationally recognized authority on RF MEMS relays, reliability, and packaging technologies. XCom Wireless is one of few merchant manufacturers developing RF MEMS, and has demonstrated the greatest capabilities of package and product design, the best overall performance, and has the capability of being the lowest-cost hybrid MEMS solution by employing a novel patent pending process. XCom has three patents (2 pending and 1 in progress) in RF MEMS structure and packaging, this technology promising to be the most robust device in development.